This documentation is generated from the source code of the SAI project, which has the following license:
© 2014 Microsoft Corporation, Dell Inc., Facebook Inc., Broadcom Corporation, Intel Corporation, Mellanox Technologies Ltd. As of January 1, 2017, the following persons or entities have made this Specification available under the Open Web Foundation Final Specification Agreement (OWFa 1.0), which is available at http://www.openwebfoundation.org/legal/the-owf-1-0-agreements/owfa-1-0 Microsoft Corporation, Dell Inc., Mellanox Technologies Ltd., Cavium, Centec Networks, Marvell International Ltd., Barefoot Networks, Facebook Inc., Intel Corporation. You can review the signed copies of the Open Web Foundation Agreement Version 1.0 for this Specification at http://opencompute.org/licensing/, which may also include additional parties to those listed above. Your use of this Specification may be subject to other third party rights. THIS SPECIFICATION IS PROVIDED "AS IS." The contributors expressly disclaim any warranties (express, implied, or otherwise), including implied warranties of merchantability, noninfringement, fitness for a particular purpose, or title, related to the Specification. The entire risk as to implementing or otherwise using the Specification is assumed by the Specification implementer and user. IN NO EVENT WILL ANY PARTY BE LIABLE TO ANY OTHER PARTY FOR LOST PROFITS OR ANY FORM OF INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES OF ANY CHARACTER FROM ANY CAUSES OF ACTION OF ANY KIND WITH RESPECT TO THIS SPECIFICATION OR ITS GOVERNING AGREEMENT, WHETHER BASED ON BREACH OF CONTRACT, TORT (INCLUDING NEGLIGEN CE), OR OTHERWISE, AND WHETHER OR NOT THE OTHER PARTY HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. THE FOLLOWING IS A LIST OF MERELY REFERENCED TECHNOLOGY: Microprocessor technology, semiconductor manufacturing technology, operating system technology (including without limitation networking operating system technology), emulation technology, graphics technology, video technology, integrated circuit packaging technology and the like, compiler technologies, object oriented technology, optical/RF communications technology including chip I/O and driver technology, bus technology, memory chip technology (including, without limitation, NAND memory, NOR memory, resistive RAM (RRAM), seek scan probe (SSP) memory, nonvolatile memory (including without limitation, memory based on chalcogenide materials, phase change memory (PCM), one or more stacked layers of memory cells, embedded PCM memories, non-volatile cache memory, solid state drives, SRAM, embedded DRAM, ferro-electric memory, and polymer memory)) and/or health-related and medical technology. IMPLEMENTATION OF THESE TECHNOLOGIES MAY BE SUBJECT TO THEIR OWN LEGAL TERMS.